Hyundai Mobis and Qualcomm Technologies have signed a memorandum of understanding to jointly develop software-defined vehicle (SDV) and advanced driver assistance system (ADAS) solutions, as automakers increasingly shift toward centralized, software-driven vehicle architectures.
The agreement brings together Hyundai Mobis’s system integration, sensor fusion and perception capabilities with Qualcomm’s automotive system-on-chip technology. Initial development will focus on solutions built on the Snapdragon Ride Flex platform, with early applications aimed at emerging markets such as India, where demand for ADAS features is expanding across multiple vehicle segments.
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Under the partnership, the companies plan to co-develop advanced driving and parking systems designed to balance performance, cost and scalability for markets with growing adoption of driver assistance technologies. Over time, the collaboration is expected to broaden to include additional SDV applications, integrating Hyundai Mobis’s standardized software platform with Qualcomm’s Snapdragon automotive technologies.
The memorandum was signed by Jung Soo-Kyung, executive vice president and head of the Automotive Electronics Business Unit at Hyundai Mobis, and Nakul Duggal, executive vice president and group general manager of Automotive, Industrial and Embedded IoT and Robotics at Qualcomm Technologies.
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Beyond ADAS, the two companies said they intend to pursue wider global supply opportunities by combining Qualcomm’s automotive computing platforms with Hyundai Mobis’s experience in hardware-software integration, electronic control units and vehicle-level system validation.
Hyundai Mobis, headquartered in Seoul, is among the world’s largest automotive suppliers, with a portfolio spanning sensors, safety systems, electrification components and vehicle software. Qualcomm Technologies, a subsidiary of Qualcomm Incorporated, develops semiconductor and software platforms used across automotive, industrial and consumer applications.
