Texas Instruments on Monday introduced a new portfolio of automotive semiconductors, including a high-performance system-on-a-chip family offering up to 1,200 trillion operations per second (TOPS) of artificial intelligence capability, as the industry pushes toward more automated and software-defined vehicles.
The announcements were made during the ongoing Consumer Electronics Show, where chipmakers and automakers are highlighting technologies aimed at enabling advanced driver assistance and, eventually, higher levels of vehicle autonomy.
See also: Pony.ai Grows Robotaxi Fleet to 1,159 Units, Surpassing 2025 Target
At the center of the launch is TI’s new TDA5 automotive SoC family, which the company said is designed to support workloads ranging from entry-level driver assistance to systems capable of meeting requirements for SAE Level 3 automated driving. The scalable platform spans AI performance from 10 TOPS to 1,200 TOPS, with power efficiency exceeding 24 TOPS per watt.
“The automotive industry is moving toward a future where driving doesn’t require hands on the wheel,” said Mark Ng, director of automotive systems at Texas Instruments. “Semiconductors are at the heart of bringing this vision of safer, smarter and more autonomous driving experiences to every vehicle.”
TI said the TDA5 family is built around Arm Cortex-A720AE processors and an integrated neural processing unit designed to handle large language models and transformer-based AI workloads. The chips are also intended to consolidate multiple vehicle domains, including advanced driver assistance, infotainment and gateway functions, while supporting ASIL-D functional safety without additional external components.
See also: Seyond Introduces Mass-Production Solid-State LiDAR With Confirmed OEM Design Win
Alongside the computing platform, TI introduced the AWR2188, an eight-transmit, eight-receive 4D imaging radar transceiver integrated into a single chip. The company said the design simplifies radar system architecture while enabling detection ranges beyond 350 meters, supporting use cases such as high-speed highway driving and improved object discrimination in dense traffic.
TI also announced the DP83TD555J-Q1 Ethernet physical layer device, which extends 10BASE-T1S connectivity to vehicle edge nodes. The component is aimed at reducing wiring complexity while enabling time-sensitive networking and power delivery over data lines for sensors and actuators.
The company said samples of the new automotive SoCs are expected to be available to selected customers toward the end of 2026, with preproduction versions of the radar and networking devices already accessible for evaluation.