Infineon Technologies will provide silicon carbide (SiC)-based power modules, microcontrollers, and power management integrated circuits (ICs) to Rivian for its next-generation R2 electric vehicle (EV) platform, with series production expected to begin in 2026.
The German semiconductor manufacturer said it will supply power modules from its HybridPACK Drive G2 family, which includes both SiC and traditional silicon (Si) components, designed for the traction inverters of Rivian’s upcoming platform. The R2 platform aims to underpin a more compact and affordable electric SUV targeted at a wider consumer base compared to Rivian’s existing R1 models.
Infineon will also deliver microcontrollers from its AURIX TC3x family as part of a comprehensive electronics solution for the new vehicle architecture.
“We are committed to enhancing the performance and range of electric vehicles jointly with innovative automotive companies like Rivian,” said Stefan Obersriebnig, head of the product line for high voltage modules in Infineon’s Automotive Division. “Our dedication for innovation and zero-defect quality has made us the preferred partner of the automotive industry. With our broad product portfolio, system expertise and manufacturing capabilities, we are a key enabler of emission-free, sustainable mobility.”
The company highlighted that its HybridPACK Drive is one of the most widely used EV power modules globally, with over 10.5 million units shipped since 2017. To meet growing demand, Infineon is expanding its SiC manufacturing capacity, including plans to establish its Kulim facility in Malaysia as a leading 200-mm SiC fab, complemented by production at its Villach site in Austria.
The R2 platform is expected to offer improved efficiency and range, with higher trims featuring a dual-motor all-wheel-drive setup. Rivian’s partnership with Infineon is part of its strategy to optimise cost and performance for volume production.
