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Home » News » China » BYD Reportedly Developing In-House Smart Driving Chip to Enhance Vehicle Intelligence
BYD

BYD Reportedly Developing In-House Smart Driving Chip to Enhance Vehicle Intelligence

By Jackson HanNovember 20, 2024No Comments2 Mins Read
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Credit: BYD

BYD is reportedly advancing its efforts to develop an in-house smart driving chip, following similar moves by competitors like Nio and Xpeng. The chip is expected to feature a computing power of 80 TOPS (Tera Operations per Second) and is planned for integration into BYD models priced between RMB 80,000 ($11,060) and RMB 300,000.

The development is led by BYD Semiconductor with technical support from select suppliers, according to a report by Chinese media outlet 36kr. This initiative aligns with BYD’s broader strategy to enhance vehicle intelligence across its lineup, including the introduction of intelligent driving systems in more affordable models in the near future.

BYD has been vocal about its ambitions to offer smart driving systems at competitive price points. Zhang Zhuo, general manager of BYD’s Ocean series sales division, previously mentioned plans to integrate these systems into models priced around RMB 150,000 or below within the next two to three years. The company also aims to release a variant of its budget-friendly Seagull model with intelligent driving features by next year.

Meanwhile, reports suggest that BYD plans to initially use Nvidia’s Orin N and Horizon Robotics’ J6E chips for models in the RMB 100,000 price range, featuring highway NOA (Navigate on Autopilot). Over time, these chips are expected to be replaced by BYD’s in-house 80 TOPS chip to streamline hardware-software integration and enable faster updates.

Developing proprietary chips positions BYD to improve efficiency and cost control while enhancing compatibility with its software algorithms. This approach is expected to solidify the automaker’s price advantage in an increasingly competitive electric vehicle (EV) market.

BYD recently showcased its ability to innovate in semiconductor design with the BYD 9000 smart cockpit chip, built on a 4 nm process, and featured in its Fang Cheng Bao sub-brand’s Bao 8 hybrid off-road SUV. By investing in in-house chip development, BYD is aligning with a trend among leading EV manufacturers to gain greater control over key technologies, ensuring competitiveness and adaptability in a rapidly evolving industry.

See Also:

  1. BYD to Introduce In-House Smart Driving Algorithms in Key Models Starting November
  2. BYD to Launch In-House Advanced Driver Assistance System by March, Reveals Report
  3. BYD Leverages 90,000 Strong R&D Team for Premium Market Expansion
  4. BYD and Huawei Partner to Develop World’s First Off-Road Smart Driving Solution
  5. BYD Achieves Record Sales of 419,426 NEVs in September, Marking a 45.91% Increase Year-on-Year
Autopilot BYD Chip Fang Cheng Bao Horizon Robotics Manufacture Semiconductor
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