Stellantis announced a partnership with Hon Hai Technology Group (Foxconn) to manufacture chips (semiconductors) to meet the needs of Stellantis and third parties.
With the new partnership, Stellantis intends to meet at least 80 percent of the chip requirements for Stellantis automotive products, a strategic move amid a shortage of semiconductors that has forced the automotive industry to adjust production.
“With Foxconn, we aim to create four new chip families that will cover more than 80 percent of our semiconductor needs, helping to significantly modernize our components, reduce complexity and simplify supply chains,” Stellantis CEO Carlos Tavares said in a statement, quoted Wednesday.
This partnership will also enhance Stellantis’ ability to innovate faster and build products and services quickly.
“As a leading global technology company, Foxconn has deep experience in semiconductor and software manufacturing — two key components in electric vehicle production,” said Young Liu, Chairman & CEO of Foxconn Technology Group.
This collaboration will support Stellantis’ initiatives to reduce semiconductor complexity, design a new family of semiconductors tailor-made to support Stellantis vehicles, and provide capability and flexibility in this increasingly critical area as vehicles become increasingly software-defined.
The partnership will leverage Foxconn’s domain knowledge, development capabilities and supply chain in the semiconductor industry, as well as Stellantis’ extensive automotive expertise and significant scale as a key customer for the company.
This announcement marks the second collaboration between Stellantis and Foxconn. In May, the company announced a joint venture Mobile Drive aimed at developing a smart cockpit solution.
