Infineon Technologies has introduced the HybridPack Drive G2 Fusion, an innovative power module designed for traction inverters in electric mobility applications. This new module leverages both silicon and silicon carbide (SiC) technologies, aiming to achieve a blend of high performance and efficiency while reducing system costs.
The Munich-based company emphasizes that this combination is essential for making electric mobility more accessible to a wider audience. The HybridPack Drive G2 Fusion is positioned to establish a new standard for power modules in the e-mobility sector, reflecting Infineon’s commitment to enhancing electric vehicle technology.
Central to the module’s design is the use of silicon and SiC chips. Silicon carbide offers advantages such as higher thermal conductivity, increased breakdown voltage, and superior switching speed. These characteristics allow SiC modules to operate more efficiently, resulting in lower heat losses and extended range for electric vehicles using the same battery capacity. However, the higher cost of SiC has typically limited its application to premium electric vehicles, while more affordable models have relied primarily on silicon semiconductors.
Infineon claims that the HybridPack Drive G2 Fusion can effectively reduce the amount of SiC used in vehicles without compromising performance or efficiency. The company suggests that system suppliers can achieve nearly the same level of efficiency as a fully SiC solution with a configuration of just 30% SiC and 70% silicon.
Additionally, the HybridPack Drive G2 Fusion maintains the user-friendly integration features of previous ‘HybridPack Drive’ modules. It is designed for quick and straightforward installation into vehicle components, requiring minimal adjustments or configurations. The new module delivers power up to 220 kW in the 750 V class.
Negar Soufi-Amlashi, Senior Vice President & General Manager of High Voltage in Infineon’s Automotive Division, stated, “Addressing the demand for greater e-mobility range, this technological breakthrough smartly combines silicon carbide and silicon. Integrated in a well-established module package footprint, it offers a compelling cost-performance ratio over pure silicon carbide modules without adding system complexity for automotive system suppliers and vehicle manufacturers.”
Infineon plans to showcase the HybridPack Drive G2 Fusion at the upcoming ‘electronica 2024’ exhibition in Munich, Germany, scheduled for November 12 to 15 (Hall C3, Stand 502).
