Hyundai Mobis, the auto parts unit of Hyundai Motor Group, is expanding its semiconductor design efforts to boost self-reliance and reduce dependence on external suppliers, according to a company insider. The supplier plans to introduce new chips over the next few years while continuing collaborations with South Korea’s semiconductor ecosystem.
The company, which specialises in connected cars, autonomous driving technology, and electrification, is targeting at least 10% of the chips used across Hyundai Motor Group to be developed in-house by 2030. Hyundai Mobis has d
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Hyundai Mobis has already co-developed 16 system semiconductors with partners and produces approximately 20 million units annually. The company operates six production lines producing seven power module models. Over the next two to three years, it plans to release ten additional chips, with CEO Lee Gyu-suk emphasizing the importance of a long-term strategy to strengthen supply chain resilience.
The company is pursuing a hybrid approach, combining in-house chip design with collaboration across the South Korean semiconductor sector. Hyundai Mobis confirmed it will work with Samsung Foundry, LX Semicon, Cadence, Synopsys, and ADT on an internally designed network SoC. Other initiatives include a body-control chip integrating five functions, due in 2026, developed with Dongwoon Anatech, DB Hitek, and ASE Korea, as well as a smart LED solution co-created with Global Technology, SK Key Foundry, and Dongbu LED.
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Looking ahead, Hyundai Mobis aims to produce power management ICs with partners and launch a silicon IGBT (Si-IGBT) in 2026, reinforcing both the automotive supply chain and South Korea’s semiconductor industry.
Source: THE ELEC, Korea Electronics Industry Media